liquid cooling compare with other air cooling

Air cooling is not enough to meet the current refrigeration needs, and even heat dissipation has restricted the development of servers and data centers. The traditional air-cooled heat dissipation method is direct heat transfer. If the heat dissipation is not good, the excessive temperature will not only reduce the stability of the chip and increase the error rate, but also cause excessive thermal stress due to the excessive temperature difference between the internal and external environment of the module, which will affect the chip's electrical performance, working frequency, mechanical strength and so on. Reliability. The application of closed cycle integrated cold plate liquid cooling technology can improve the heat dissipation efficiency of the processor in the harsh working environment to a greater extent through the integrated liquid cold exhaust cycle module. The temperature of the server CPU can be stabilized at about 50 C at full load, which further guarantees the stable multi-threaded continuous over-frequency working ability of the CPU terminal.